Samsung to Use TSMC 3nm Process for Nvidia Next-Generation HBM Base Dies
Samsung Electronics Co., Ltd. (OTC:SSNLF) will utilize Taiwan Semiconductor Manufacturing Co., Ltd. (NYSE:TSM) and its 3-nanometer manufacturing process to build base dies for next-generation custom high-bandwidth memory chips designed for NVIDIA Corporation (NASDAQ:NVDA). Nvidia requested that major memory manufacturers, including SK hynix Inc. (NASDAQ:SKHY) and Micron Technology, Inc. (NASDAQ:MU), adopt TSMC's process for NVHBM base dies while using sixth-generation DRAM technology for core dies.
This decision represents the initial instance of Samsung collaborating directly with TSMC during the high-bandwidth memory production process. Introduced in August, NVHBM integrates Nvidia's custom memory controller directly into the base die to create a uniform implementation across memory suppliers. Samsung accepted the specifications following an internal evaluation, though it intends to preserve its internal manufacturing setup for standard memory products and custom designs built for other clients.
Looking ahead, Samsung is assessing whether its own semiconductor manufacturing facilities could produce NVHBM base dies if total market demand eventually rises above TSMC's available output limit.
Key points
- Samsung Electronics will produce base dies for Nvidia's next-generation custom high-bandwidth memory using TSMC's 3-nanometer manufacturing process.
- Nvidia asked Samsung, SK hynix, and Micron Technology to use TSMC's process for NVHBM base dies and sixth-generation DRAM for core dies.
- The arrangement marks the first time Samsung and TSMC have collaborated on high-bandwidth memory manufacturing.
- Samsung will retain its in-house manufacturing for standard memory and custom chips made for other clients while evaluating if its own foundry could produce NVHBM base dies if needed.
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How we writeDisclaimerQuestions and answers
Why is Samsung using TSMC technology for Nvidia HBM chips?
Nvidia requested that memory suppliers use TSMC's 3-nanometer process for NVHBM base dies to integrate its custom memory controller and standardize memory implementation across suppliers.
Is Samsung stopping its own memory chip manufacturing?
No. Samsung plans to keep its internal manufacturing model for standard high-bandwidth memory and custom products for other customers, and it may use its own foundry if demand exceeds TSMC's capacity.
Which memory makers were asked to adopt TSMC's process for NVHBM?
Nvidia requested that Samsung, SK hynix, and Micron Technology use TSMC's 3-nanometer process for NVHBM base dies alongside sixth-generation DRAM for core dies.