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Celestica Launches 102.4Tbps Liquid-Cooled AI Data Center Switch

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Celestica Inc. (TSX:CLS) has introduced the DS6005, a new co-packaged optics data center switch built for artificial intelligence networking fabrics. Powered by Broadcom Tomahawk 6 silicon, the switch provides bandwidth capacity of up to 102.4Tbps. Shares of Celestica Inc. rose 2.02% to 516.8 CAD following the announcement.

The hardware features a 1.5OU liquid-cooled design built for OCP ORv3 racks. By eliminating traditional front pluggable optics, the switch architecture is designed to reduce total cost for data center operators by lowering power usage and signal latency. The move expands the company's hardware lineup for scaling AI cluster fabrics.

Investors will be tracking future customer design wins, production rollouts, and verified power or cost savings as operators begin deploying the new networking technology.

Key points

  • Celestica Inc. launched the DS6005 co-packaged optics switch for high-density AI data center networks.
  • The device is built on Broadcom Tomahawk 6 silicon and delivers networking capacity of up to 102.4Tbps.
  • Its 1.5OU liquid-cooled form factor fits OCP ORv3 racks and removes front pluggable optics to cut latency and power usage.
  • Celestica Inc. shares rose 2.02% to 516.8 CAD following the product release.

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Questions and answers

What is the Celestica DS6005 switch?

The DS6005 is a co-packaged optics data center switch designed by Celestica Inc. for AI networking fabrics, delivering up to 102.4Tbps of bandwidth.

How does Celestica's new CPO switch reduce power consumption?

The switch eliminates front pluggable optics and uses a 1.5OU liquid-cooled design, which helps operators lower latency, cut power demands, and reduce overall operating costs.

Which silicon processor powers the Celestica DS6005?

The DS6005 switch is built using Broadcom Tomahawk 6 silicon.